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- Contact Person : Ms. Huang Sally
- Company Name : Shenzhen Shuttle Star Industrial Co., Ltd.
- Tel : 86-755-27512579
- Fax : 86-755-27513017
- Address : Guangdong,shenzhen,3F Bld B, Huangtian Brightway Industrial Park Xixiang Baoan
- Country/Region : China
- Zip : 518128
BD-M12B FOG and FOB Main Press Bonding Machine
Product Detailed
Related Categories:Used Packaging Machinery
BD-M12B is a manual FPC and PCB main press bonding machine. It is used for pasting FPC on PCB or other Panels with IC.
Features: Platform can be adjusted, it adopts vacuum adsorption during pasting; PCB has vacuum adsorption or pressing fits; Rodless cylinder drives the platform move linearly; Platform is made of high abrasive resistance aluminum alloy or anti-static material; FPC platform can be adjusted at X, Y, Z and direction( using micrometer and θdirection have axletree); Double startup switch ensures the operators'safety; When pressing the emergency switch, the thermal indenter rises up; the platform will be reposition only after the emergency switch reset; Pressure/temperature/time display and adjusting device are fixed at the visible front of the machine; the adjusting device can be locked up to avoid changing the setting by wrong operation; Have shifter fitting to select automatic or manual production mode; Have account function(can clear to zero) static eliminator can be selected according to the machines dimension, the function scope covers 2 hot pressing area; static eliminator can be selected according to the machines dimension, the function scope covers hot pressing area; Cylinder uses worldwide well-known brand component such as SMC or CKD and etc; Indenter and cylinder have counterbalance valves which used to eliminate deadweight; Main spare parts are all imported; Temperature controller can set maximum and minimum limits, if the temperature is out of this limit, the machine wont be on production status; Have sound and light alarm function.Specifications:
Item | Specification |
Scope of application | FPCTCPPCB and so on |
LCD size | 112.1inch |
FPC | Max:15280mm |
Number of FPC | Max:8 |
Size of indenter | main press 300*1.5mm(can be customized) |
Number of indenters | 1 |
Cylinder Diameter | Ø63 |
Pressure | 10~800N |
Silicon rubber rolling fitting | Roll the silicon rubber back and forward manually |
Heating mode | Permanent heating |
Heating temperature | RT400°C |
Temperature tolerance | ±3°C |
Working period | 13S(Bonding time is :10S) |
Time set | 130S |
Contrapuntal mode | Contraposition to XYθ manually, which is helped by CCD image |
LCD localizing | Localize by locating block |
XY adjust the distance of FPC workbench | ±6.5mm |
θ adjust the angle of FPC workbench | ±15° |
Bonding Definition | ±0.01mm |
Smallest lens spacing | 6mm |
Fitting Pitch | ≥45 um |
Magnification times of CCD | 80160 |
Center-to-center lens spacing | 11200 (mm) |
CCD fixing mode | Up contraposition |
Monitor | 8 inch LCD(2pcs) |
Movement mode of workbench | Rodless cylinder + linear guide rail |
Rating Power | 2000KW |
Power supply | AC220V,50/60 HZ |
Supply | 0.50.7MPa |
External Dimension | 800L×830W×800 Hmm |
Weight | about 200kg |
BD-M12B FOG and FOB Main Press Bonding Machine
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