X - RAY semiconductor high-definition inspect equipment(X3000)

1. Inported original micro X-ray tube. 2. 19" LCD monitor 3. Multi-fuction software system 4. 1.3millon CCD camera 5. CE

Applications:

1. Semiconductor: Inner structure of IC, FC, CSP package inspection

2. Aluminum casting relate to cars, bubble &fissure of rubber and resin products inspection

3. Short & open circuit in BGA package, bubble area in BGA inspection and auto-judgment

4. Aerospace and military, aerofoil, bullet etc.

5. troche in medicine, FRP in chemical products, resin, ceramics

6. lithium battery, electronic components(capacitor, resistor, diode & audion, led etc.) inspection

Features:

1.Imported Micro X-Ray tube with original packaging(100/130Kv closed tube), highly-sensitive image intensifier, 1.3 million pixels industrial digital CCD camera, able to detect item <5μm,display clear image.

2. Adjustable high power geometric & system magnification, easy to find out tiny defect with high detecting speed.

3. System laser positioning

4. Four axis moving coordinately, with function of CNC auto-detects in quantity, suitable for detecting in large quantity with high accuracy.

5. 19" digital image-special LCD monitor, displaying large and high definition image.

6. Multi-function software system, free maintenance and update for life.

7.Complete seal lead cabinet, comply with the provisions of the international and domestic X-ray safety standards.

8. No tilt, can optionally equipped with 360°rotated jig

Specifications:

X - RAY semiconductor high-definition inspect equipment(X3000)