reballing BGA RW-SP360C

RW-SP360C -----Maquina de reballing BGA *new model with Laser locator *PLC control *repair laptop, XBOX, PS3...

 Nueva maquina de reballing BGA RW-SP360C-lleva Localizador láser

Specification: 

Applicable PCB size

 Max PCB size: 430mmX350mm

Applicable BGA size

 Max size: 55mmX55mm

 Min size: 7mmX7mm

Max weight: 80g

Power for operation: 3600W

Main heater: 800W

Lower heater: 800W

Bottom heater: 2000W

Machine dimension:L620*W580*H650mm

Machine weight: 33KGs

Input power: AC 220V 3.6KW

Description

*High quality heating material produces high-tem breeze, precisely controlling the soldering and desoldering process.

*Movable heating head, able to move horizontally; easy to operate;

*Embedded industrial computer, touch screen interface, PLC control; real-time temperature curve display, able to display set curve and practically-tested curve; 7.2’ high definition screen, convenient for operation and observation;

*Industrial computer able to store unlimited temperature curves, curve analysis can be done on touch screen; both English and Chinese can be input;

*The temperatures of the upper and lower heater can be precisely controlled according to set temperatures; bottom constant temperature infrared heating area; appropriate temperature control apparatus can ensure safe rework for BGA;

*The BGA soldering supporting frame can micro-adjusted to avoid local sinkage;

*Powerful cross flow can cool the lower heating area;

*The adjustable PCB positioning supports, easy and fast to install PCB; special fixture for installing allotype boards ;

*with sound alarming function after finishing soldering or desoldering; hand vacuum pen easy for picking up BGA;

*Set with over temperature alarming and protection function;

*Equipped with different hot gas nozzles, easy to replace; can be customized according to specific needs;

*The integrated design of machine and chassis is room-saving.

reballing BGA RW-SP360C